1 high frequency fets unit: mm 2SK690 gaas n-channel mes fet for uhf medium output power amplification n features l large collector dissipation p c l mini-power type package, allowing downsizing of the sets and automatic insertion through the tape/magazine packing. n absolute maximum ratings (ta = 25c) parameter drain to source voltage gate to source voltage drain current gate current allowable power dissipation channel temperature storage temperature operating ambient temperature symbol v ds v gs i d i g p d * t ch t stg t opr ratings 10 - 6 0.6 1 1 150 - 55 to +150 - 35 to +85 unit v v a ma w c c c n electrical characteristics (ta = 25c) * pc board: copper foil of the drain portion should have a area of 1cm 2 or more and the board thickness should be 1.7mm. parameter drain current drain cut-off current gate to source leakage current gate to drain current gate to source cut-off voltage forward transfer admittance output power power gain additional efficiency symbol i dd * 1, 2 i dsx i gss i gdo v gsc | y fs | p out pg h add conditions v ds = 5v, v gs = 0 v ds = 10v, v gs = - 6v v ds = 0, v gs = - 6v v ds = 16v v ds = 5v, i ds = 1ma v ds = 5v, i ds = 50ma, f = 1khz v ds = 6v, i ds = 100ma f = 940mhz, p in = 10dbm min 150 90 20 10 typ 350 150 25 15 51 unit ma ma m a m a v ms dbm db % max 600 2 50 500 - 6 1: gate 2: source 3: drain eiaj: sc-62 mini-power type package (3-pin) 4.50.1 2.60.1 2.50.1 0.4max. 1.0 +0.1 C0.2 4.0 +0.25 C0.20 3.00.15 1.50.1 0.40.08 0.50.08 1.50.1 0.40.04 1.60.2 45? marking 321 marking symbol: m internal connection * 1 i dss rank classification rank i dss (ma) p 150 to 280 q 220 to 380 r 320 to 600 * 2 pulse measurement d s g 1k w 8.2v 12v zener di zener di maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
2 high frequency fets p d ? ta i d ? v ds | y fs | ? v gs c iss , c oss , c rss ? v ds p out ? p in h add ? p in p out ? v gs h add ? v gs 2SK690 0 240 200 160 40 120 80 0 1.2 1.0 0.8 0.6 0.4 0.2 copper foil of the drain portion should have a area of 1cm 2 or more and the board thickness should be 1.7mm. ambient temperature ta ( ?c ) allowable power dissipation p d ( mw ) 06 5 4 13 2 0 180 150 120 90 60 30 ta=25?c v gs =C 0.8v C 0.9v C 1.0v C 1.1v C 1.2v C 1.3v drain to source voltage v ds ( v ) drain current i d ( ma ) ?.0 1.0 0.5 0 ?.5 ?0.5 ?.0 0 300 250 200 150 100 50 v ds =5v f=1khz ta=25?c gate to source voltage v gs ( v ) forward transfer admittance |y fs | ( ms ) 1 3 10 30 100 0 2.4 2.0 1.6 1.2 0.8 0.4 v gs =?v f=1mhz ta=25?c c iss c oss c rss drain to source voltage v ds ( v ) input capacitance ( common source ) , output capacitance ( common source ) , reverse transfer capacitance ( common source ) c iss ,c oss ,c rss ( pf ) C30 30 20 10 C20 0 C10 C20 40 30 20 10 0 C10 v ds =6v i ds =100ma f=940mhz p in =10dbm input voltage p in ( dbm ) output power p out ( dbm ) ?0 30 20 10 ?0 0 ?0 0 60 50 40 30 20 10 v ds =6v i ds =100ma f=940mhz p in =10dbm input voltage p in ( dbm ) additional efficiency h add ( % ) 0C4 C1 C3 C2 C30 30 20 10 0 C10 C20 v ds =6v i ds =100ma f=940mhz p in =10dbm gate to source voltage v gs ( v ) output power p out ( dbm ) 0 ?.0 ?.5 ?.0 ?0.5 ?.5 ?.0 0 60 50 40 30 20 10 v ds =6v i ds =100ma f=940mhz p in =10dbm gate to source voltage v gs ( v ) additional efficiency h add ( % ) maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd. maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://www.semicon.panasonic.co.jp/en/
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